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USB2226 4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs
PRODUCT FEATURES
Complete System Solution for interfacing SmartMediaTM (SM) or xD Picture CardTM (xD), Memory StickTM (MS), High Speed Memory Stick (HSMS), Memory Stick PRO (MSPRO), MS DuoTM, Secure Digital (SD), Mini-Secure Digital (Mini-SD), TransFlash (SD), MultiMediaCardTM (MMC), Reduced Size MultiMediaCard (RS-MMC), NAND Flash, Compact FlashTM (CF) and CF UltraTM I & II, and CF form-factor ATA hard drives to USB 2.0 bus -- Supports USB Bulk Only Mass Storage Compliant Bootable BIOS Support for simultaneous operation of all above devices. (only one at a time of each of the following groups supported: CF or ATA drive, SM or XD or NAND, SD or MMC) Compliant with xD specifications for either Card Reader/Writer or Player mode applications On-Chip 4-Bit High Speed Memory Stick and MS PRO Hardware Circuitry On-Chip firmware reads and writes High Speed Memory Stick and MS PRO 1-bit ECC correction performed in hardware for maximum efficiency On-chip power FETs for supplying flash media card power with minimum board components USB Bus Power Certified 3.3 Volt I/O Complete USB Specification 2.0 Compatibility for Bus Powered Operation -- Includes USB 2.0 Transceiver -- A Bi-directional Control and a Bi-directional Bulk Endpoint are provided. 8051 8 bit microprocessor Double Buffered Bulk Endpoint -- Bi-directional 512 Byte Buffer for Bulk Endpoint -- 64 Byte RX Control Endpoint Buffer -- 64 Byte TX Control Endpoint Buffer Datasheet Internal Program Memory On Board 24Mhz Crystal Driver Circuit Can be clocked by 48MHz external source On-Chip 1.8V Regulator for Low Power Core Operation Internal PLL for 480Mhz USB 2.0 Sampling, Configurable MCU clock Activity LED output Compatible with Microsoft WinXP, WinME, Win2K SP3, Apple OS10, Softconnex, and Linux Multi-LUN Mass Storage Class Drivers Win2K, Win98/98SE and Apple OS8.6 and OS9 Multi-LUN Mass Storage Class Drivers available from SMSC 128 Pin VTQFP Lead-free RoHS Compliant Package (1.0mm height, 14mm x14mm footprint)
SMSC USB2226
DATASHEET
Revision 1.4 (10-08-07)
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
ORDER NUMBERS: USB2226-NU-XX FOR 128 PIN, VTQFP LEAD-FREE ROHS COMPLIANT PACKAGE
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123 Copyright (c) 2007 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC's website at http://www.smsc.com. SMSC is a registered trademark of Standard Microsystems Corporation ("SMSC"). Product names and company names are the trademarks of their respective holders. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Table of Contents
Chapter 1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Chapter 2 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Chapter 3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Chapter 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Chapter 5 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 5.2 PIN Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Chapter 6 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 6.2 6.3 Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Chapter 7 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
List of Tables
Table 5.1 Table 5.2 Table 6.1 Table 7.1 CLK_SEL[1:0] Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB2226 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB2226 128-Pin VTQFP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16 19 23
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
List of Figures
Figure 3.1 USB2226 128-Pin VTQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 4.1 USB2226 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 7.1 USB2226 128-Pin VTQFP Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SMSC USB2226
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Chapter 1 General Description
The USB2226 is a USB 2.0 Bulk Only Mass Storage Class Peripheral Controller intended for supporting CompactFlash (CF and CF Ultra I/II) in True IDE Mode only, SmartMedia (SM) and XD cards, Memory Stick (MS), Memory Stick DUO (MSDUO) and Memory Stick Pro (MSPRO), Secure Digital (SD), and MultiMediaCard (MMC) flash memory devices. It provides a single chip solution for the most popular flash memory cards in the market. The device consists of a USB 2.0 PHY and SIE, buffers, Fast 8051 microprocessor with expanded scratchpad, and program SRAM, and CF, MS, SM and SD controllers. The SD controller supports both SD and MMC devices. SM controller supports both SM and xD cards. The USB2226 can read and write the following card formats: Secure Digital (SD), High Capacity SD (HC-SD), High Speed SD (HS-SD), Mini-SD, Micro-SD MultiMediaCard (MMC), MMCplus (HS-MMC), High Capacity MMC (HC-MMC), RS-MMC, MMCMobile Memory Stick (MS), MS Duo, Memory Stick PRO (MSPro), Memory Stick PRO-HG (Pro-HG) xD Picture Card, Type M, Type H SmartMedia (SM), TransFlash Compact Flash MicroDrive Media activity LED output is also provided. Internal power FETs are provided to directly supply power to the xD/SM, MMC/SD and MS/MSPro cards. The internal ROM program implements a multi-LUN CF/SD/MMC/SM/MS reader function with individual card power control and activity indication. SMSC also provides licenses** for Win98 and Win2K drivers and setup utilities. Note: Please check with SMSC for precise features and capabilities for the current ROM code release.
*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other intellectual property rights from or through various persons or entities, including without limitation media standard companies, forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses or technical information available; does not promise or represent that any such licenses or technical information will actually be obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or otherwise with respect to, any such technical information. SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with respect to infringement, including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such devices, or to any combinations involving any of them, with respect to infringement or claimed infringement of any existing or future patents related to solid state disk or other flash memory technology or applications ("Solid State Disk Patents"). By making any purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk and other flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses under Solid State Disk Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the subject of this document which may be sold to the customer, and any sale by SMSC of such units to the customer, are valid exercises of the customer's rights and licenses under such Solid State Disk Patents; that SMSC shall have no obligation for royalties or otherwise under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such units; and that SMSC shall have no obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any Solid State Disk Patents. SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES AGAINST INFRINGEMENT AND THE LIKE. No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask work right, trade secret, or other intellectual property right. **To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of these Software License Agreements may be obtained by contacting SMSC.
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Chapter 2 Acronyms
SM: SmartMedia SMC: SmartMedia Controller FM: Flash Media FMC: Flash Media Controller CF: Compact Flash CFC: CompactFlash Controller SD: Secure Digital SDC: Secure Digital Controller MMC: MultiMediaCard MS: Memory Stick MSC: Memory Stick Controller TPC: Transport Protocol Code. ECC: Error Checking and Correcting CRC: Cyclic Redundancy Checking
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Chapter 3 Pin Configuration
VSS RBIAS ATEST VDD33 VDD18PLL XTAL1 XTAL2 VSSPLL CF_nPWR VDD18 NC VDD33 VDD33 SD_nCD NC VSS NC ACT_LED nRESET NC NC NC NC NC NC NC NC NC NC NC NC NC
96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
nTEST0 nTEST1 VBUS CLK_SEL1 CLK_SEL0 NC NC VDDA33 USBDP USBDM VSSA VSS VSS SM_nCE SM_nWE SM_nRE VDD33 SM/xD_PWR SM_nCD SM_nB/R SM_nWPS SM_CLE SM_nWP SM_ALE SM_D7 SM_D6 SM_D5 SM_D4 SM_D3 SM_D2 SM_D1 SM_D0
97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128
SMSC USB2226 TQFP 128
( Top View)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
CF_SA2 CF_SA1 CF_SA0 CF_nCS1 CF_nCS0 CF_ nRESET CF_ nIOW CF_ nIOR CF_ IORDY CF_IRQ CF_nCD2 CF_nCD1 CF_D15 CF_D14 CF_D13 VDD18 CF_D12 VSS CF_D11 CF_D10 SD/MMC_PWR VDD33 MS_PWR CF_D9 CF_D8 CF_D7 CF_D6 CF_D5 CF_D4 CF_D3 CF_D2 CF_D1
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NC NC VDD33 NC NC NC NC NC NC NC NC NC NC NC VSS VSS NC MS_I NS MS_D0 MS_D1 MS_D2 MS_D3 MS_SCLK MS_BS SD_nWP SD_DAT0 SD_DAT1 SD_DAT2 SD_DAT3 SD_CMD SD_CLK CF_D0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Figure 3.1 USB2226 128-Pin VTQFP
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Chapter 4 Block Diagram
512 Bytes EP 2 TX/RX Buffer B Auto address generators Address EP0TX_BC 512 Bytes EP 2 TX/RX Buffer A 64 Bytes EP 1RX 64 Bytes EP 1TX 64 Bytes EP 0RX EP0RX_BC
Address MUX
F MC Data MUX
Address Register
XDATA & SFR Address and Data busses
7 pins
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Datasheet
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs
1.25KB SRAM
Address
Address
64 Bytes EP 0TX
Flash Media DMA Unit
Flash Media Controllers (FMC)
CF Controller Control/ Status
Memory Cards
D ata Buss
EP1TX_BC
Address
DATA 60M Hz
32 Bit
EP1RX_BC
Address Address
CF
RAMW R_A/B
Latch phase 0, 2 SIE
Latch phase 3 8051
Latch phase 1 FMC
DATA ECC Control/ Status SM Controller Control/ Status SM/SSFDC
RAMRD_A/B
Address
Data @ 32 bit 15Mhz
DATA CRC MS Controller Control/ Status SD Controller Control/ Status MS/HS MS/MS PRO
DATA CRC
SD/MMC
Clocked by Phase 0, 2 Clock SIE ( Serial Interface Engine )
32 bit 15MHz Data Buss 12K Byte Scratchpad SRAM SIE Control Regs PWR_FET0 PWR_FET1 PW R_FET2 SD/MMC_PWR MS _PWR SM /xD_PW R
USB 2.0 PHY ( Transceiver )
Configuration and Control
GPIO
Clock Generation Interrupt Controller Osc
Scratchpad SRAM (768 Byte)
64K ROM
M EM/IOBus 29 u 2 9 P i n s M E Bus 29pins MEM/IO B Pins MEM /IOM / I OBuss 29 pins
XTAL
FAST 8051 CPU CORE
CLOCKOUT
24 MHz
Clocked by Phase 3 Clock
Figure 4.1 USB2226 Block Diagram
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Chapter 5 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional groups according to their associated interface. The "n" symbol in the signal name indicates that the active, or asserted state occurs when the signal is at a low voltage level. When "n" is not present before the signal name, the signal is asserted when at the high voltage level. The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of "active low" and "active high" signal. The term assert, or assertion indicates that a signal is active, independent of whether that level is represented by a high or low voltage. The term negate, or negation indicates that a signal is inactive.
5.1
SYMBOL
PIN Descriptions
128-PIN VTQFP BUFFER TYPE DESCRIPTION
CompactFlash (In True IDE mode) INTERFACE CF_nCS1 61 O8PU CF Chip Select 1: This pin is the active low chip select 1 signal for the CF ATA device. CF_nCS0 60 O8PU CF Chip Select 0: This pin is the active low chip select 0 signal for the task file registers of CF ATA device in the True IDE mode. CF_SA2 64 O8 CF Register Address 2: This pin is the register select address bit 2 for the CF ATA device. CF_SA1 63 O8 CF Register Address 1: This pin is the register select address bit 1 for the CF ATA device. CF_SA0 62 O8 CF Register Address 0: This pin is the register select address bit 0 for the CF ATA device. CF_IRQ 55 IPD CF Interrupt: This is the active high interrupt request signal from the CF device. CF_D[15:8] 52 51 50 48 46 45 41 40 I/O8PD CF Data 15-8: The bi-directional data signals CF_D15-CF_D8 in True IDE mode data transfer. In the True IDE Mode, all of task file register operation occur on the CF_D[7:0], while the data transfer is on CF_D[15:0]. The bi-directional data signal has an internal weak pull-down resistor.
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
SYMBOL CF_D[7:0]
128-PIN VTQFP 39 38 37 36 35 34 33 32 56
BUFFER TYPE I/O8PD CF Data 7-0:
DESCRIPTION
The bi-directional data signals CF_D7-CF_D0 in the True IDE mode data transfer. In the True IDE Mode, all of task file register operation occur on the CF_D[7:0], while the data transfer is on CF_D[15:0]. The bi-directional data signal has an internal weak pull-down resistor. IPU IO Ready: This pin is active high input signal. This pin has an internally controlled weak pull-up resistor.
CF_IORDY
CF_nCD2
54
IPU
CF Card Detection2: This card detection pin is connected to the ground on the CF device, when the CF device is inserted. This pin has an internally controlled weak pull-up resistor.
CF_nCD1
53
IPU
CF Card Detection1: This card detection pin is connected to ground on the CF device, when the CF device is inserted. This pin has an internally controlled weak pull-up resistor.
CF_nRESET
59
O8
CF Hardware Reset: This pin is an active low hardware reset signal to CF device.
CF_nIOR
57
O8
CF IO Read: This pin is an active low read strobe signal for CF device.
CF_nIOW
58
O8
CF IO Write Strobe: This pin is an active low write strobe signal for CF device. SmartMedia INTERFACE
SM_nWP
74
O8PD
SM Write Protect: This pin is an active low write protect signal for the SM device. This pin has a weak pull-down resistor that is permanently enabled.
SM_ALE
73
O8PD
SM Address Strobe: This pin is an active high Address Latch Enable signal for the SM device. This pin has a weak pull-down resistor that is permanently enabled.
SM_CLE
75
O8PD
SM Command Strobe: This pin is an active high Command Latch Enable signal for the SM device. This pin has a weak pull-down resistor that is permanently enabled.
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
SYMBOL SM_D[7:0]
128-PIN VTQFP 72 71 70 69 68 67 66 65 81
BUFFER TYPE I/O8PD SM Data 7-0:
DESCRIPTION
These pins are the bi-directional data signal SM_D7-SM_D0. The bi-directional data signal has an internal weak pull-down resistor.
SM_nRE
08PU
SM Read Enable: This pin is an active low read strobe signal for SM device. When using the internal FET, this pin has an internal weak pull-up resistor that is tied to the output of the internal Power FET.
08
If an external FET is used (Internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used, and should be connected to the applicable Card Power Supply). SM Write Enable: This pin is an active low write strobe signal for SM device. When using the internal FET, this pin has an internal weak pull-up resistor that is tied to the output of the internal Power FET.
SM_nWE
82
O8PU
08
If an external FET is used (Internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used, and should be connected to the applicable Card Power Supply). SM Write Protect Switch: A write-protect seal is detected, when this pin is low. This pin has an internally controlled weak pull-up resistor.
SM_nWPS
76
IPU
SM_nB/R
77
I
SM Busy or Data Ready: This pin is connected to the BSY/RDY pin of the SM device. An external pull-up resistor is required on this signal. The pull-up resistor must be pulled up to the same power source that powers the SM/NAND flash device.
SM_nCE
83
O8PU
SM Chip Enable: This pin is the active low chip enable signal to the SM device. When using the internal FET, this pin has an internal weak pull-up resistor that is tied to the output of the internal Power FET.
08
If an external FET is used (Internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used, and should be connected to the applicable Card Power Supply). SM Card Detection: This is the card detection signal from SM device to indicate if the device is inserted. This pin has an internally controlled weak pull-up resistor. MEMORY STICK INTERFACE
SM_nCD
78
IPU
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
SYMBOL MS_BS
128-PIN VTQFP 24
BUFFER TYPE O8 MS Bus State:
DESCRIPTION
This pin is connected to the BS pin of the MS device. It is used to control the Bus States 0, 1, 2 and 3 (BS0, BS1, BS2 and BS3) of the MS device. MS_SDIO/MS_ D0 19 I/O8PD MS System Data In/Out: This pin is a bi-directional data signal for the MS device. Most significant bit (MSB) of each byte is transmitted first by either MSC or MS device. The bi-directional data signal has an internal weak pull-down resistor. MS_D1 20 I/O8PD MS System Data In/Out: This pin is a bi-directional data signal for the MS device. This pin has internally controlled weak pull-up and pull-down resistors for various operational modes. MS_D[3:2] 22 21 I/O8PD MS System Data In/Out: This pin is a bi-directional data signal for the MS device. The bi-directional data signal has an internal weak pull-down resistor. MS_INS 18 IPU MS Card Insertion: This pin is the card detection signal from the MS device to indicate, if the device is inserted. This pin has an internally controlled weak pull-up resistor. MS_SCLK 23 O8 MS System CLK: This pin is an output clock signal to the MS device. The clock frequency is software configurable. SD INTERFACE SD_DAT[3:0] 29 28 27 26 31 I/O8PU SD Data 3-0: These are bi-directional data signals. These pins have internally controlled weak pull-up resistors. O8 SD Clock: This is an output clock signal to SD/MMC device. The clock frequency is software configurable. SD_CMD 30 I/O8PU SD Command: This is a bi-directional signal that connects to the CMD signal of SD/MMC device. This pin has an internally controlled weak pull-up resistor. SD_nWP 25 IPD SD Write Protected: This pin is an input signal with an internal weak pull-down. This pin has an internally controlled weak pull-down resistor.
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SD_CLK
DATASHEET
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
SYMBOL
128-PIN VTQFP
BUFFER TYPE USB INTERFACE
DESCRIPTION
USBDM USBDP RBIAS
87 88 98
I/O-U
USB Bus Data: These pins connect to the USB bus data signals.
I
USB Transceiver Bias: A 12.0k, 1.0% resistor is attached from VSSA to this pin, in order to set the transceiver's internal bias currents.
ATEST
99
AIO
Analog Test: This signal is used for testing the analog section of the chip and should be connected to VDDA33 for normal operation.
VDD18PLL VSSPLL
101 104
1.8v Power for the PLL PLL Ground Reference: Ground Reference for 1.8v PLL power
VDDA33 VSSA
89 86
3.3v Analog Power Analog Ground Reference: Analog Ground Reference for 3.3v Analog Power.
XTAL1/ CLKIN
102
ICLKx
Crystal Input/External Clock Input: 24Mhz Crystal or external clock input. This pin can be connected to one terminal of the crystal or can be connected to an external 24Mhz clock when a crystal is not used. Note: The `MA[2:0] pins will be sampled while nRESET is asserted, and the value will be latched upon nRESET negation. This will determine the clock source and value.
XTAL2
103
OCLKx
Crystal Output: 24Mhz Crystal This is the other terminal of the crystal, or left open when an external clock source is used to drive XTAL1/CLKIN. It may not be used to drive any external circuitry other than the crystal circuit. MISC
ACT_LED
114
I/O8
Media Activity LED: This active low output will blink if any media is accessed by the USB host.
VBUS
94
I/O8
VBUS Input: This pin should be connected to the USB bus VBUS signal through a 100K resistor voltage divider to provide 2.5v when VBUS = 5.0v.
SD_nCD
110
I/O8
SD Card Detection: This is the card detection signal from SD socket to indicate if the device is inserted. This pin has an internally controlled weak pull-up resistor.
MS_PWR
42
I/O8
MS Card Power drive of 3.3V @ 100mA.
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
SYMBOL CF_nPWR
128-PIN VTQFP 105
BUFFER TYPE I/O8 CF Card Power Control:
DESCRIPTION
This active low output is intended to drive an external power control P-FET which will supply the CF card with power. SM/xD_PWR SD/MMC_PWR CLK_SEL[1:0] 79 44 92 93 I/O8 I/O8 I/O8 SM / xD Card Power drive of 3.3V @ 100mA. SD / MMC Card Power drive of 3.3V @ 200mA. Clock Select: These pins will select the maximum clock rate that the interface will operate at. Table 5.1 CLK_SEL[1:0] Assignments CLK_SEL1 X 0 1 CLK_SEL0 1 0 0 CLOCK RATE SD/MMC and MS max clock is 15Mhz SD/MMC max clock is 48Mhz; MS clock is set normally SD/MMC max clock is 24Mhz; MS clock is set normally
nRESET
115
IS
RESET input: This active low signal is used by the system to reset the chip. The active low pulse should be at least 1s wide.
nTEST[1:0]
95 96
I
TEST input: These signals are used for testing the chip. User should normally tie them high externally, if the test function is not used.
DIGITAL POWER, GROUNDS, and NO CONNECTS VDD18 49 106 1.8v Digital Core Power: +1.8V Core power All VDD18 pins must be connected together on the circuit board. VDD33 3 43 80 100 108 109 15 16 47 84 85 97 112 3.3v Power & Voltage Regulator Input: 3.3V Power & Regulator Input. pins 100 & 108 supply 3.3V power to the internal 1.8V regulators.
VSS
Ground: Ground Reference
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DATASHEET
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
SYMBOL NC
128-PIN VTQFP 1 2 4 5 6 7 8 9 10 11 12 13 14 17 90 91 107 111 113 116 117 118 119 120 121 122 123 124 125 126 127 128 Notes:
BUFFER TYPE
DESCRIPTION No Connect; pins must be left unconnected.
Hot-insertion capable card connectors are required for all flash media. It is required for SD connector to have Write Protect switch. This allows the chip to detect MMC card. VDD18 (Pin 106) and VDD18PLL (Pin 101) must have a 10uF +/-20% Low-ESR (equivalent series resistance) <0.1 ohm bypass capacitor to VSSA. These capacitors must be as close to these pins as possible.
5.2
Buffer Type Descriptions
Table 5.2 USB2226 Buffer Type Descriptions BUFFER I IPU IPD IS I/O8 I/O8PU Input Input with internal weak pull-up resistor. Input with internal weak pull-down resistor. Input with Schmitt trigger Input/Output buffer with 8mA sink and 8mA source. Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor. DESCRIPTION
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Table 5.2 USB2226 Buffer Type Descriptions (continued) BUFFER I/O8PD O8 O8PU O8PD ICLKx OCLKx I/O-U AIO DESCRIPTION Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-down resistor. Output buffer with 8mA sink and 8mA source. Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor. Output buffer with 8mA sink and 8mA source, with an internal weak pull-down resistor. XTAL clock input XTAL clock output Analog Input/Output Defined in USB specification Analog Input/Output
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DATASHEET
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Chapter 6 DC Parameters
6.1 Maximum Guaranteed Ratings
SYMBOL TA MIN -55 MAX 150 325 VDD33, VDDA33 -0.5 -0.5 4.0 (3.3V supply voltage + 2) 6 UNITS C C V V Soldering < 10 seconds COMMENTS
PARAMETER Storage Temperature Lead Temperature 3.3V supply voltage Voltage on VBUS & USBDP/DM pins Voltage on MS_PWR, SD/MMC_PWR, SM/xD_PWR
-0.5
VDD33 + 0.3
V
When internal power FET operation of these pins is enabled, these pins may be simultaneously shorted to ground or any voltage up to 3.63V indefinitely, without damage to the device as long as VDD33 and VDDA33 are less than 3.63V and TA is less than 70C.
Voltage on any signal pin Voltage on XTAL1 Voltage on XTAL2
-0.5 -0.5 -0.5
VDD33 + 0.3 4.0 VDD18 + 0.3
V V V
Note: Stresses above the specified parameters may cause permanent damage to the device. This is a stress rating only and functional operation of the device at any condition above those indicated in the operation sections of this specification is not implied. Note: When powering this device from laboratory or system power supplies, it is important that the Absolute Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. When this possibility exists, it is suggested that a clamp circuit be used.
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SMSC USB2226
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
6.2
Recommended Operating Conditions
PARAMETER SYMBOL TA VDD33, VDDA33 MIN 0 3.0 -0.3 MAX 70 3.6 5.5 UNITS C V V If any 3.3V supply voltage drops below 3.0V, then the MAX becomes: (3.3V supply voltage) + 0.5 5.5 COMMENTS
Operating Temperature 3.3V supply voltage Voltage on VBUS & USBDP/DM pins
Voltage on any signal pin Voltage on XTAL1 Voltage on XTAL2
-0.3 -0.3 -0.3
VDD33 VDDA33 VDD18
V V V
Table 6.1 DC Electrical Characteristics PARAMETER I,IPU & IPD Type Input Buffer Low Input Level High Input Level Pull Down Pull Up IS Type Input Buffer Low Input Level High Input Level Hysteresis ICLK Input Buffer Low Input Level High Input Level Input Leakage (All I and IS buffers) Low Input Leakage High Input Leakage IIL IIH -10 -10 +10 +10 A mA VIN = 0 VIN = VDD33 VILCK VIHCK 2.2 0.4 V V VILI VIHI VHYSI 2.0 500 0.8 V V mV TTL Levels VILI VIHI PD PU 2.0 72 58 0.8 V V A A TTL Levels SYMBOL MIN TYP MAX UNITS COMMENTS
SMSC USB2226
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Revision 1.4 (10-08-07)
DATASHEET
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
PARAMETER O8, O8PU, and O8PD Type Buffer Low Output Level
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
VOL
0.4
V
IOL = 8 mA @ VDD33= 3.3V
High Output Level
VOH
VDD33 - 0.4
V
IOH = -8mA @ VDD33= 3.3V
Output Leakage
IOL
-10
+10
A A A
VIN = 0 to VDD33 (Note 6.1)
Pull Down
PD
72
Pull Up I/O8, I/O8PU & I/O8PD Type Buffer Low Output Level
PU
58
VOL
0.4
V
IOL = 8 mA @ VDD33= 3.3V
High Output Level
VOH
VDD33 - 0.4
V
IOH = -8 mA @ VDD33= 3.3V
Output Leakage
IOL
-10
+10
A
VIN = 0 to VDD33 (Note 6.1)
Pull Down
PD
72
A
Pull Up IO-U (Note 6.2)
PU
58
A
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SMSC USB2226
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
PARAMETER Integrated Power FETs for MS_PWR or SM/xD_PWR Output Current
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
IOUT
100
mA
MS_PWR or SM/xD_PWR; VdropFET = 0.23V MS_PWR or SM/xD_PWR; VoutFET = 0V MS_PWR or SM/xD_PWR; IFET = 70mA MS_PWR or SM/xD_PWR; CLOAD = 10F
Short Circuit Current Limit
ISC
140
mA
On Resistance
RDSON
2.1
Output Voltage Rise Time
tDSON
800
s
Integrated Power FET for SD/MMC_PWR Output Current IOUT 200 mA SD/MMC_PWR; VdropFET = 0.46V SD/MMC_PWR; VoutFET = 0V SD/MMC_PWR; IFET = 70mA SD/MMC_PWR; CLOAD = 10F
Short Circuit Current Limit
ISC
181
mA s mA mA mA A
On Resistance
RDSON
2.1
Output Voltage Rise Time Supply Current Unconfigured Supply Current Active (Full Speed) Supply Current Active (High Speed) Supply Current Standby Note 6.1 Note 6.2 Note 6.3
tDSON ICCINIT ICC ICC ICSBY 55 75 75 305
800 80 90 100 420
Output leakage is measured with the current pins in high impedance. See Appendix A for USB DC electrical characteristics. The Maximum power dissipation parameters of the package should not be exceeded.
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DATASHEET
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
6.3
Capacitance
TA = 25C; fc = 1MHz; VDD18, VDD18PLL = 1.8V LIMITS PARAMETER SYMBOL CIN MIN TYP MAX 20 UNIT pF TEST CONDITION All pins except USB pins (and pins under test tied to AC ground)
Clock Input Capacitance
Input Capacitance Output Capacitance
CIN COUT
10 20
pF pF
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs Datasheet
Chapter 7 Package Outlines
Figure 7.1 USB2226 128-Pin VTQFP Package Outline Table 7.1 USB2226 128-Pin VTQFP Package Parameters MIN A A1 A2 D D1 E E1 H L L1 e q W R1 R2 ccc 0o 0.13 0.08 0.08 ~ Notes:
1. Controlling Unit: millimeter. 2. Tolerance on the true position of the leads is 0.035 mm maximum. Package body dimensions D1 and E1 do not include the mold protrusion. 3. Maximum mold protrusion is 0.25 mm. 4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane. 5. Details of pin 1 identifier are optional but must be located within the zone indicated.
NOMINAL ~ ~ ~ ~ ~ ~ ~ ~ 0.60 1.00 0.40 Basic ~ 0.18 ~ ~ ~
MAX 1.20 0.15 1.05 16.20 14.20 16.20 14.20 0.20 0.75 ~ 7o 0.23 ~ 0.20 0.08
REMARKS Overall Package Height Standoff Body Thickness X Span X body Size Y Span Y body Size Lead Frame Thickness Lead Foot Length Lead Length Lead Pitch Lead Foot Angle Lead Width Lead Shoulder Radius Lead Foot Radius Coplanarity
~ 0.05 0.95 15.80 13.80 15.80 13.80 0.09 0.45 ~
SMSC USB2226
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Revision 1.4 (10-08-07)
DATASHEET

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